Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle![™]()
microLED technology, supporting a wide range of die-to-die interfaces.
microLED technology, supporting a wide range of die-to-die interfaces. San Diego, CA — March 25, 2024 — Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA (https://www.ofcconference.org/en-us/home/). The chiplet interconnect extends ultra-high density die-to-die (D2D) connections up to 10m at multi-Tbps/mm shoreline bandwidth density and class leading sub-pJ/bit energy efficiency. Based on Avicena’s LightBundle platform which supports unprecedented shoreline density and energy efficiency, it unlocks increased performance from HPC and AI cluster architectures.